Polyimide (PI) is a high-performance organic polymer material that holds a vital position in industrial applications due to its excellent high-temperature resistance, mechanical properties, chemical stability, and electrical insulation.
Its molecular structure contains imide groups (-CO-N-CO-), and this unique chemical bond endows the material with stability under extreme environments, making it one of the core materials in high-end manufacturing fields such as aerospace, electronics, and automotive.
The processing of PAI requires strict control of temperature and humidity. During injection molding, the barrel temperature should be set at 320-380℃, and the mold temperature at 150-200℃ to avoid material degradation. The melt flow index (MFR) is typically controlled at 5-30 g/10 min (265℃/5 kg) to ensure a balance between flowability and mechanical properties. In terms of industry standards, internationally, ASTM D4066 (Specification for Polyamide-Imide Resins) and IEC 60664-1 (Performance Ratings of Insulation Materials) are followed, while domestically, GB/T 23641 (General Test Methods for Engineering Plastics) is referenced.
